Garment integrated electrical interface system and method of manufacture

ABSTRACT

A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/869,398, filed 29 Sep. 2015, which claims the benefit of U.S.Provisional Application Ser. No. 62/057,226 filed 29 Sep. 2014, and U.S.Provisional Application Ser. No. 62/153,904 filed 28 Apr. 2015. U.S.application Ser. No. 14/869,398, filed 29 Sep. 2015 is acontinuation-in-part application of U.S. application Ser. No. 14/742,420filed 17 Jun. 2015, which claims the benefit of U.S. ProvisionalApplication Ser. No. 62/013,405 filed 17 Jun. 2014, and U.S. ProvisionalApplication Ser. No. 62/016,373 filed 24 Jun. 2014. Each of the aboveapplications is incorporated in its entirety herein by this reference.

TECHNICAL FIELD

This invention relates generally to the biometric device field, and morespecifically to a new and useful garment integrated electrical interfacesystem and method of manufacture.

BACKGROUND

Tracking biometric parameters resulting from periods of physicalactivity can provide profound insights into improving one's performanceand overall health. Historically, users have tracked their exercisebehavior by manually maintaining records of aspects of their physicalactivity, including time points, durations, and/or other metrics (e.g.,weight lifted, distance traveled, repetitions, sets, etc.) of theirexercise behavior. Exercise tracking systems and software have beenrecently developed to provide some amount of assistance to a userinterested in tracking his/her exercise behavior; however, such systemsand methods still suffer from a number of drawbacks. In particular, manysystems require a significant amount of effort from the user (e.g.,systems rely upon user input prior to and/or after a period of physicalactivity), capture insufficient data (e.g., pedometers that estimatedistance traveled, but provide little insight into an amount of physicalexertion of the user), provide irrelevant information to a user, and areincapable of detecting body-responses to physical activity at aresolution sufficient to provide the user with a high degree of bodyawareness. Other limitations of conventional biometric monitoringdevices include one or more of: involvement of single-use electrodes,involvement of electrodes that have limited reusability, involvement ofa single electrode targeting a single body location, involvement of aprofessional for electrode placement, use of adhesives for electrodeplacement, electrode configurations that result in user discomfort(e.g., strap-based systems), use of electrode configurations that areunsuited to motion-intensive activities of the user, use of wiredsystems that constrain mobility, and other deficiencies.

Furthermore, integration of biometric tracking systems into garmentsworn by a user is particularly challenging. Challenges include: couplingconductors to garments in a manner that still allows the garment to moveand stretch with motion of the user; preventing a conducting fluid(e.g., sweat) from shorting various conductors coupled to a garment;creating an assembly that can be washed and reused without compromisingthe circuitry and processors through which the system operates; routingsignal conduction pathways across seams of a garment; accommodating ahigh connection density; customizing garment fit to a user; transmittingsignals acquired by way of the garment to a processing system; anddesigning for aesthetics, scalability, and maintaining electrode-skincontact during use by a user.

There is thus a need in the biometric device field to create a new anduseful garment integrated electrical interface system and method ofmanufacture. This invention provides such a new and useful system andmethod of manufacture.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 depicts a cross sectional view of an example embodiment of asystem 100 for conducting electrical signals from a garment to a dataacquisition device.

FIG. 2 depicts a schematic of an example embodiment of the system 100.

FIG. 3 depicts a first exploded view of an example embodiment of thesystem 100.

FIG. 4 depicts a second exploded view of an example embodiment of thesystem 100.

FIG. 5 depicts a third exploded view of an example embodiment of thesystem 100.

FIG. 6 depicts a schematic of an example embodiment of a portion of thesystem 100.

FIGS. 7A, 7B, and 7C depict cross sectional views of various exampleembodiments of portions of the system 100.

FIG. 8 depicts an exploded view of an alternate example embodiment ofthe system 100.

FIG. 9 depicts an exploded view of a portion of an alternate exampleembodiment of the system 100.

FIG. 10 depicts an illustration of further alternate example embodimentsof the system 100.

FIG. 11 depicts a cutaway of an example embodiment of the system 100.

FIG. 12 illustrates the operation of an example embodiment of the system100 with a mating object 30.

FIG. 13 is a block schematic of a method 200 of manufacture of a systemsimilar to the system 100.

FIG. 14 is a schematic illustration of a portion of Block S250 of themethod 200.

FIG. 15 is a schematic illustration of a portion of Block S260 of themethod 200.

FIG. 16 is a cross sectional view of an example embodiment of the system100.

FIG. 17 is a cross sectional view of an example embodiment of the system100.

FIG. 18 is a cross sectional view of an example embodiment of the system100.

FIG. 19 is a cross sectional view of an example embodiment of the system100.

FIG. 20 is a cross sectional view of an example embodiment of the system100.

FIG. 21 is a cross sectional view of an example embodiment of the system100.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description of the preferred embodiments of the inventionis not intended to limit the invention to these preferred embodiments,but rather to enable any person skilled in the art to make and use thisinvention.

1. System

As shown in FIGS. 1-3, an embodiment of a system 100 for electricallycoupling a garment to a mating object 30 includes: a fabric interlayer110 of the garment including a set of ports 115; a backing plate 140,adjacent to a first side of the fabric interlayer 110, including a setof through holes aligned with the set of ports 5; an electronicssubstrate 120 having a first surface adjacent to a second side of thefabric interlayer 110 and including a set of vias 122 through athickness of the electronics substrate 120, aligned with the set ofthrough holes and the set of ports 115, and a set of contacts at asecond surface opposing the first surface; a mount assembly 130 having athird surface adjacent to the second surface of the electronicssubstrate 120 and including a set of holes aligned with the set of vias122, the set of ports 115, and the set of through holes, as well as aset of openings i32 that correspond to and receive portions of the setof contacts, and a fourth surface opposing the third surface anddefining a cavity 131 configured to receive and electrically interfacethe mating object 30 to the electronics substrate 120; and a set offasteners 150 that 1) compress the backing plate 140, the fabricinterlayer 110, the electronics substrate 120, and the mount assembly130 by way of the set of through holes, the set of ports 115, the set ofvias 122, and the set of holes in supporting a waterproof seal 134, and2) electrically couple the set of ports 115 to the set of vias 122. Asdescribed in more detail below, one or more variations of the system 100can omit one or more of the above elements, in providing a suitableinterface between a garment and a mating object.

The system 100 functions to facilitate transmission of biometric signalsfrom the fabric interlayer 110 to the mating object 30 (e.g., a portablecontrol module as described herein), wherein the biometric signals canbe detected from a user who is performing some type of physical activityand subsequently processed to provide information to the user insubstantially near real time, such that the user can gain insights intohow to maintain or improve performance of the physical activity in abeneficial manner. The system 100 can additionally or alternativelyfunction to protect signal conductor connections, insulate and isolatesignal conductors in communication with the system 100, shield thesignal conductor connections from noise sources, alter the arrangementof signal conductor contact points between the fabric interlayer no andthe mating object 30, and provide a secure retention location for themating object 30. As such, the system 100 can be used to transferbiometric signals (or other signals) in a manner that has improved washdurability, improved comfort and fit, improved appearance compared toconventional options, and improved integration between the matingobject(s) 30 and the garment.

In variations, the system 100 is configured to facilitate transmissionof detected bioelectrical signals generated at multiple body regions ofa user who is exercising (e.g., performing aerobic exercise, performinganaerobic exercise), wherein a plurality of electrode units incommunication with the system 100 can be positioned at multiple bodyregions of the user, in order to generate a holistic representation ofone or more biometric parameters relevant to activity of the user. Assuch, bioelectrical signals transmittable by the system 100 can includeany one or more of: electromyography (EMG) signals, electrocardiography(ECG) signals, electroencephalograph (EEG) signals, galvanic skinresponse (GSR), bioelectrical impedance (BIA), and any other suitablebioelectrical signal of the user. The system 100 can, however, beconfigured to transmit any other suitable biosignal data of the user,including one or more of: muscle activity data, heart rate data,movement data, respiration data, location data, skin temperature data,environmental data (e.g., temperature data, light data, etc.), and anyother suitable data. Additionally or alternatively, the system 100 canbe configured to transmit any other suitable type of electrical signal,including one or more of: audio signals, communication signals, humanproduced signals, device produced signals, and any other type of signalthat can be transferred through a conductive medium.

Preferably, the system 100 is configured to be integrated with a garment400 worn by a user during a period of physical activity, as described inU.S. application Ser. No. 14/541,446, entitled “System and Method forMonitoring Biometric Signals” and filed on 14 Nov. 2014, U.S.application Ser. No. 14/079,629, entitled “Wearable Architecture andMethods for Performance Monitoring, Analysis, and Feedback” and filed on13 Nov. 2013, U.S. application Ser. No. 14/079,621, entitled “WearablePerformance Monitoring, Analysis, and Feedback Systems and Methods” andfiled on 30 Jan. 2014, U.S. application Ser. No. 14/699,730, entitled“Biometric Electrode System and Method of Manufacture” and filed on 29Apr. 2015, and U.S. application Ser. No. 14/724,420, entitled “BiometricSignal Conduction System and Method of Manufacture” and filed on 17 Jun.2015, each of which is incorporated herein in its entirety by thisreference. As such, the system 100 is preferably configured to provide aliquid-tight interface (e.g., by way of a seal) between conductivecomponents of the garment and conductive receptors on the mating object30, upon coupling of the mating object 30 to the system 100, such thatsweat or water which may be intermingled with the fabric(s) of thegarment cannot penetrate the system 100 and interfere with sensitiveportions (e.g., conductive leads) of the system 100 during use. Evenfurther, in relation to integration with a garment 400, the system 100is preferably configured to be washable (i.e., hand-washable, machinewashable, etc.), to be sweat-proof, to sustain stretching of theintegrated fabric, to be scalable (e.g., in terms of size, in terms ofvolume of manufacture, etc.), to be low-maintenance, and to functionproperly and in a robust manner in relation to seams of the garment.Furthermore, the system 100 is preferably configured to be incorporatedinto a garment independent of the nature of the particular garment(e.g., underwear, outerwear, loose-fitting, tight-fitting, syntheticmaterial, natural material, or any other characteristics particular tovarious suitable garments). The system 100 comprises: a fabricinterlayer 110 of the garment including a set of ports 115, to whichbiometric signals can be conducted; an electronics substrate 120including a set of vias 122; a mount configured to receive andelectrically interface a mating object 30 to the electronics substrate120; and a set of fasteners 150 to mechanically and electrically linkthe set of ports 115 and the set of vias 122, thereby enabling signaltransfer and/or information transfer from the fabric interlayer 110 to amated object for processing, storage and/or transmission. In oneembodiment, the system 100 remaps the pattern of ports 115 from onesuitable for manufacture in the fabric interlayer no to one suitable forinterfacing with the mating object 30 (e.g., a portable data acquisitionand processing unit). The system 100 can additionally or alternativelyact as a hub for signals and information routed to the fabric interlayerno from throughout the garment without requiring connections between thedisparate regions of the garment where the signals originate andindividual data collection/processing modules. As such, the system 100can provide an improved design for routing signals and biometricinformation from regions of a garment with integrated sensors while auser is performing a physical activity.

The system 100 is preferably configured to be used by a user who is awayfrom a research or clinical setting, such that the user is interfacingwith a portion of the system 100 while he or she undergoes periods ofphysical activity in a natural, non-clinical setting (e.g., at a gym,outdoors, etc.). The system 100 can additionally or alternatively beconfigured to be operated by a user who is in a research setting, aclinical setting, or any other suitable setting for the collection ofbiometric data. Embodiments, variations, and/or examples of the system100 can be manufactured according to embodiments, variations, and/orexamples of the method 200 described in Section 2 below; however, thesystem 100 can additionally or alternatively be fabricated using anyother suitable method.

1.1 System—Supporting Elements

As noted above and as shown in FIG. 12, the system 100 can be integratedwith a wearable garment 400. The system 100 is preferably furtherconfigured to be in communication with a set of biosensing contacts 500and a portable control module 30 that couples to the garment 400, inoperation, by way of the system 100 . The system 100 is preferablyaffixed to the garment 400 (e.g., using a set of screws, rivets, pins,adhesives, sewing, etc.); However, the system 100 can additionally oralternatively provide coupling between electronic components and/or tothe garment 400 by way of one or more of: crimp connectors, snapconnectors, stitching, a chemical bond, and any other suitable couplingagent.

The garment 400 is preferably composed of a form-fitting and washablematerial that is configured to be worn on at least a portion of a user'sbody. In one variation, the system 100 can be coupled to the exterior ofthe garment 400, to an inner lining of the garment 400, be removablycoupled with respect to any suitable portion of the garment 400, ortraverse a portion of the garment. Coupling between the system 100 andthe garment 400 can be permanent (e.g., by way of heat binding, by wayof gluing, by way of stitching, etc.) or non-permanent (e.g., by usingVelcro™, by using fasteners, by using buttons, by using a lightadhesive, etc.). The garment 400 can thus include a stretchable and/orcompressive fabric comprising natural and/or synthetic fibers (e.g.,nylon, Lycra, polyester, spandex, etc.) to promote coupling (i.e.,electrical coupling, mechanical coupling) and/or reduce motion artifactsthat could otherwise result from relative motion between the skin of theuser and the system 100 .

In examples, the garment 400 can include any one or more of: a top(e.g., shirt, jacket, tank top, bra etc.), bottom (e.g., shorts, pants,capris etc.), elbow pad, knee pad, arm sleeve, leg sleeve, socks,undergarment, neck wrap, glove, and any other suitable wearable garment.Furthermore, the garment 400 can include one or more slots, pouches,ports, bases, pathways, channels, cradles, or other features by whichthe system 100 and/or set of biosensing contacts 500 can permanently orremovably couple to the garment 400.

The set of biosensing contacts 500 function to receive signals from thebody of the user, and to transmit signals through the system 100 to themating object 30 during use by the user. The set of biosensing contacts500 is preferably an embodiment, variation, or example of the set ofbiosensing contacts described in U.S. application Ser. No. 14/699,730entitled “Biometric Electrode System and Method of Manufacture” andfiled on 29 Apr. 2015, which is herein incorporated in its entirety bythis reference; however, the set of biosensing contacts 500 canadditionally or alternatively include any other suitable contactsconfigured to receive and transmit signals to the system 100 .

In relation to the set of biosensing contacts 500, the garment 400 canbe configured to position the set of biosensing contacts 500 proximal toone or more of: the pectoralis muscles, the abdominal muscles, theoblique muscles, the trapezius muscles, the rhomboid muscles, the teresmajor muscles, the latissimus dorsi muscles, the deltoid muscles, thebiceps muscles, and the triceps muscles when the garment 400 is worn bythe user. Additionally or alternatively, the garment 400 can beconfigured to position the set of biosensing contacts 500 proximal toone or more of: the gluteus maximus muscles, the gluteus medius muscles,the vastus lateralis muscles, the gracilis muscles, the semimembranosusmuscles, the semitendinosis muscles, the biceps femoris, the quadricepsmuscles, the soleus muscles, the gastrocnemius muscles, the rectusfemoris muscles, the sartorius muscles, the peroneus longus muscles, andthe adductor longus muscles when the garment 400 is worn by the user.Variations of the garment 400 can, however, be configured to positionthe set of biosensing contacts 500 on the body of the user in any othersuitable manner or location.

As discussed above, the garment 400 can be configured to couple toand/or communicate with one or more mating objects 30 by means of thesystem 100. As such, the combination of the garment 400 and the system100 can provide one or more sites of coupling with the mating object(s)30 in a manner that does not interfere with activity of the user (e.g.,during exercise), while allowing the mating object(s) 30 to interfacewith all sensor sites governed by the set of biosensing contacts 500. Invariations, the mating object(s) 30 can include circuitry for processingsignals, storing data, and/or transmitting data, derived from signalsreceived at the set of biosensing contacts 500 and transmitted throughthe system 100, to a computing device external to the garment 400.Additionally, the mating object 30 preferably cooperates with the system100 by which the mating object 30 physically couples to the wearablegarment 400 and/or by which the mating object 30 electrically couples tothe biosensing contacts 500. For example, the mating object 30 canpermanently or removably couple to the garment 400 when forming anelectrical connection with the system 100, examples of which are shownin FIGS. 11-12. Thus, coupling the mating object 30 to the garment 400can include depositing the mating object 30 into the system 100 coupledto the garment 400 and in communication with a set of conductive leadsof the biosensing contacts 500. In one example embodiment, the system100 includes both physical coupling elements and electrical couplingelements that establish an electrical coupling between the biosensingcontacts 500 and the mating object 30 when the user physically couplesthe mating object 30 to the system 100. The mating object 30 can includeembodiments, variations, and examples of the control module described inU.S. application Ser. No. 14/541,446, entitled “System and Method forMonitoring Biometric Signals” and filed on 14 Nov. 2014; however, themating object 30 can additionally or alternatively include any othersuitable mating object 30.

The system 100 described below can, however, cooperate with or otherwisebe integrated with any other suitable elements as described in one ormore of: U.S. application Ser. No. 14/541,446, entitled “System andMethod for Monitoring Biometric Signals” and filed on 14 Nov. 2014, U.S.application Ser. No. 14/079,629, entitled “Wearable Architecture andMethods for Performance Monitoring, Analysis, and Feedback” and filed on13 Nov. 2013, U.S. application Ser. No. 14/079,621, entitled “WearablePerformance Monitoring, Analysis, and Feedback Systems and Methods” andfiled on 30 Jan. 2014, U.S. application Ser. No. 14/699,730, entitled“Biometric Electrode System and Method of Manufacture” and filed on 29Apr. 2015, and U.S. application Ser. No. 14/724,420, entitled “BiometricSignal Conduction System and Method of Manufacture” and filed on 17 Jun.2015. Additionally or alternatively, the system 100 can additionally oralternatively be configured to interface with any other suitableelement(s).

1.2 System—Overview of Integrated Biometric Signal Interface

As noted above and as shown in FIGS. 1-5, an embodiment of the system100 includes: a fabric interlayer no of the garment including a set ofports 115; a backing plate 140, adjacent to a first side of the fabricinterlayer no, including a set of through holes 145 aligned with the setof ports 115; an electronics substrate 120 having a first surfaceadjacent to a second side of the fabric interlayer 110 and including aset of vias 122 through a thickness of the electronics substrate 120,aligned with the set of through holes and the set of ports 115, and aset of contacts 124 at a second surface opposing the first surface, eachcontact in the set of contacts 124 electrically connected to a via inthe set of vias 122; a mount assembly 130 having a third surfaceadjacent to the second surface of the electronics substrate 120 andincluding a set of blind holes 136 aligned with the set of vias 122, theset of ports 115, and the set of through holes, as well as a set ofopenings that correspond to and receive portions of the set of contacts,and a fourth surface opposing the third surface and defining a cavity131 configured to receive and electrically interface the mating object30 to the electronics substrate 120; and a set of fasteners 150 that 1)compress the backing plate 140, the fabric interlayer no, theelectronics substrate 120, and the mount assembly 130 by way of the setof through holes, the set of ports 115, the set of vias 122, and the setof blind holes 136 in supporting a waterproof seal 134, and 2)electrically couple the set of ports 115 to the set of vias 122. Again,as described in more detail below, one or more variations of the system100 can omit one or more of the above elements, in providing a suitableinterface between a garment and a mating object.

In particular, the set of vias 122 can perform one or more of:functioning as a set of electrical contact points to the set of ports115, routing an electrical signal from one side of the electronicssubstrate 120 to another side of the electronics substrate 120, andproviding a set of holes through which the set of fasteners 150 canpass. Preferably, the above functions are performed simultaneously, butalternatively the above functions may be performed separately or in anysuitable combination. Furthermore, in a specific example, each of theset of vias 122 can include a conductive port through one or more layersof the electronics substrate 120, wherein each via includes a contactpad (configured to make contact with at least one of the set of ports115) with an opening there through. As described in more detail below,the set of vias can, however, be configured in any other suitablemanner.

The system 100 is preferably manufacturable in a manner that is at leastpartially independent of manufacturing of remaining portions of thegarment 400. As such, in one example, an entity (e.g., a manufacturingentity, a user) can affix the system 100 to a garment, as long as thegarment provides the appropriate array of ports 115 in a layer of thegarment. The layer of the garment providing the appropriate array ofports 115 is preferably a fabric layer, but can alternatively be anon-fabric layer or any suitable portion of the garment. The system 100in this example can comprise two portions that are removably coupled(e.g., clasped, snapped, or clamped) around the fabric layer such thatthe ports 115 of the fabric layer are integrated, between the twoportions, into the system 100. Alternatively, the system 100 can bemanufactured directly into the garment such that it is not easilyattached/detached by a user. Furthermore, variations of this example ofthe system 100 can be designed to couple with any type of garment 400(e.g., shorts, pants, shirts, etc.) by aligning positions of elements ofthe system 100 relative to a particular garment 400, without the need tochange design aspects of the system 100. Furthermore, variations of thisexample of the system 100 can be designed to couple with any garmentmaterial (e.g., cotton, polyester, Spandex, Lycra, Elastane, etc.)without compromising functionality of the system 100. Therefore, thesystem 100 can provide improved manufacturing scalability andcustomization with respect to different types of garments 400.

1.2.1 System—Fabric Interlayer

As shown in FIGS. 3-6, the fabric interlayer 110 preferably includes aset of ports 115 in electrical communication with at least one biometricsensor, and functions to route biometric signals originating fromvarious regions of the garment to the set of ports 115. The fabricinterlayer no additionally functions to provide a substrate for therouting of electrically conductive traces 113 integrated into the fabricand for arranging the set of ports 115. The fabric interlayer 110 ispreferably an information transfer inlay, examples of which aredescribed in U.S. application Ser. No. 14/742,420, entitled “BiometricSignal Conduction System and Method of Manufacture”, filed 17 Jun. 2015,which is incorporated in its entirety herein by reference; however, thefabric interlayer no can alternatively be any suitable portion of thegarment at which a set of electrical access points (preferably in theform of ports) to various connected biometric sensors is provided.

In more detail, while the fabric interlayer 110 is preferably flexibleand elastic, the fabric interlayer 110 can alternatively compriseregions that are rigid or exhibit flexibility elasticity and rigidity(e.g., by using a combination of rigid and flexible materials) or anycombination of the three. In variations, the fabric interlayer no can becomposed of one or more of: fabric, cloth, and any other materialcapable of being stitched together and/or stitched into. In examples,the fabric interlayer no can be composed of one or more of: Polyester,Nylon, Polypropylene, wool, Spandex, and any other natural or syntheticmaterial. In one specific example, the fabric interlayer no can comprisea nylon-spandex composite (e.g., a nylon-spandex circular knitcontaining 68% nylon and 32% spandex), which is lightweight and canstretch in multiple directions even upon coupling of the system 100 tothe garment 400.

As shown in FIG. 4, each port in the fabric interlayer 110 is preferablythe terminus of an electrically conductive trace 113 located within afabric and/or embroidery region of the fabric interlayer 110, andpreferably provides an electromechanical access point that iselectrically coupled to a conductive fabric portion and/or conductiveembroidery region of the garment. Preferably, the ports are arranged inthe fabric interlayer no as shown in FIGS. 4-6. Alternatively, the portcan be located along any portion of the electrically conductive trace113, or be electrically coupled to the trace 113 in any suitable manner.Preferably, the port is a metallic grommet that is embedded in thefabric interlayer 110 such that at least a portion of the port isaccessible from either side of the layer, and that provides a centerhole that passes through a thickness of the fabric interlayer no. In analternative variation, at least one of the ports can be a grommet madeof an electrically conductive polymer. However, alternative variationsof the port(s) can be composed of any other suitable conductivematerial.

Furthermore, at least one of the ports can be a raised portion of thefabric interlayer 110, a region of the fabric interlayer 110 that isflush with the surrounding regions of the fabric interlayer no, a solidconductive contact surface, and/or partially or completely covered by anadditional conductive layer or layers. In additional alternativevariations, the port(s) can comprise any suitable structure that enableselectrical communication between the fabric interlayer 110, otherportions of the system 100, and at least one biometric sensor coupled tothe garment.

1.2.2 System—Electronics Substrate

The electronics substrate 120 is coupled to a first side of the fabricinterlayer no, and functions to route electrical signals between thefabric interlayer no and the electronics substrate 120. The electronicssubstrate 120 includes a set of vias 122 through a thickness of theelectronics substrate 120 that are aligned with the set of ports 115 ofthe fabric interlayer no. The electronics substrate 120 can also includea set of contacts 124, at a surface of the electronics substrate 120opposing the fabric interlayer no, such that each of the contacts isconnected to at least one of the vias. The electronics substrate 120 canthus also function to provide signal routing pathways from the set ofvias 122 to the set of contacts 124. The electronics substrate 120 ispreferably adjacent to the fabric interlayer no, but can alternativelybe separated by one or more additional layers of another material (e.g.,fabric, polymer sheet, plastic film, etc.) that provide suitablepathways for electrical continuity between portions of the set of vias122 and portions of the set of contacts 124. The electronics substrate120 is preferably a substantially flat plate-like structure with a smallthickness (e.g., 0.1-2 mm), but can alternatively have a morphology thatconforms to the curvature of the surface of a user's body and/or thefabric interlayer no, and/or can be configured with any suitablemorphology that enables the set of vias 122 to interface with the set ofports 115. The electronics substrate 120 is preferably a rigid printedcircuit board (PCB), but can alternatively be semi-rigid, flexible, becomposed of rigid and flexible regions, or have any other suitablestructural consistency. The electronics substrate 120 is preferably madeof an electrically insulating material, but can alternatively bepartially conductive/semi-conductive, partially or completely coatedwith an insulating layer, or any suitable combination of insulatingand/or conductive portions that prevent unwanted electricalcommunication between vias in the set of vias 122 or ports in the set ofports 115 (e.g., short-circuiting).

The electronics substrate 120 is preferably mechanically andelectrically coupled to the fabric layer by the set of fasteners 150 byway of the set of ports 115 and the set of vias 122, but alternativelycan be coupled by any suitable means that provides electricalcommunication between the set of vias 122 and the set of ports 115 andmechanical support between the fabric layer and the electronicssubstrate 120. Examples of alternative means of coupling the electronicssubstrate 120 to the fabric layer include: adhesives, thermal bonding,straps, clips, snaps, and any other suitable coupling means. Examples ofalternative means of coupling the set of vias 122 to the set of ports115 include: snaps, conductive adhesives, clips, wires, welding,soldering, sewing together with conductive thread, or any other suitableelectrical coupling means.

In some variations, the set of vias 122 can be coupled to the set ofports 115 in a one-to-one manner, as shown in FIGS. 4-5. Alternatively,a single via can be coupled to a plurality of ports, or a single portcan be coupled to a plurality of vias, such that the set of vias 122 andthe set of ports 115 are coupled in a non-one-to-one manner.Furthermore, in alternative variations, the system 100 can comprise asingle via and/or a single port in the set of vias 122 and the set ofports 115, respectively.

The set of vias 122 preferably comprises a set of vias 122 that passentirely through the electronics substrate 120 (e.g., a set of throughholes with conductive linings). Alternatively, the vias can include oneor more blind vias, and/or one or more buried vias. In more detail, eachvia in the set of vias 122 preferably comprises at least one conductivepad on one or both sides of the electronics substrate. The conductivepad functions as a substantially flat location at which conductiveportions of the system 100 can be brought into electrical communicationwith the via. The pad is preferably at least as large as a projectedarea of a grommet in variations including a set of grommets, butalternatively can be any suitable size.

The set of contacts 124 can further function to route electrical signalsthat enter the electronics substrate 120 in a first arrangement definedby the set of vias 122 to a second arrangement defined by the set ofcontacts 124. Preferably, the first and second arrangements aredifferent, but alternatively they can be similar or identical.Preferably, the second arrangement is more compact than the firstarrangement (i.e., the average intra-contact spacing is preferably lessthan the average intra-via spacing), but alternatively it can beidentical or less compact than the first arrangement. Preferably, thesecond arrangement corresponds to an arrangement of receiving positionson the mating object 30, but can alternatively correspond to anysuitable arrangement. The first arrangement can be constrained by, forexample: manufacturing processes, material properties, structuralcharacteristics, any other relevant constraint, or any of theseconstraints applied to the set of ports 115 of the fabric interlayer 110(with which set of vias 122 are preferably aligned). As such, inexamples, the first arrangement can be constrained in terms of one ormore of: pattern density, inter-port spacing, a material-relatedparameter, manufacturability of the fabric interlayer or other portionsof the system 100, and any other suitable constraining factor. Thesecond arrangement may not have any constraints, can be optimized toprovide a compact interface to the mating object 30, or can be arrangedin any other suitable manner. In one example variation, as shown in FIG.5, the set of ports 115 of the fabric interlayer 110 and the set of vias122 of the electronics substrate 120 are constrained by a minimuminter-port distance between ports in the fabric interlayer no determinedby a requirement to avoid short-circuits between ports, and the set ofcontacts 124 is specifically arranged to interface with a small and/orcompact mating object 30 (e.g., a portable control module), such thatthe constraint associated with the set of ports 115 of the fabricinterlayer 110 is different than the constraint associated with the setof vias 122 of the electronics substrate 120. In another relatedexample, the first arrangement of the set of ports 115 of the fabricinterlayer 110 follows an open elliptic curve and the second arrangementassociated with the set of contacts 124 of the electronics substrate 120is a rectilinear gridded arrangement.

The set of contacts 124 preferably protrude from a surface of theelectronics substrate 120 opposing the surface of the electronicssubstrate 120 that is coupled to the fabric interlayer 110. In oneexample, the set of contacts 124 comprises a set of frustoconicalprotrusions arrayed on the electronics substrate 120. Alternatively, thecontacts can be raised from a different surface or not raised at all.The set of contacts 124 preferably is electrically connected to and hasa one-to-one correspondence with the set of vias 122. Alternatively,multiple vias can correspond to a single contact, and/or multiplecontacts can correspond to a single via. The set of contacts 124 can beelectrically connected to the set of vias 122 by a set of electricallyconductive traces on and/or in the electronics substrate 120, or anyother suitable means of electrical connection (e.g., wiring, soldering,brazing, welding, fastening, etc.) Preferably, the set of contacts 124comprises contacts composed of an electrically conductive, elastic, andcompliant material (e.g., electrically conductive silicone, electricallyconductive polymer, etc.) that facilitates maintenance of electricalcommunication between the contacts 124 and the mating object 30 duringmotion of the user. Alternatively or additionally, the contacts 124 canbe individually spring-loaded in order to maintain electricalcommunication between the contacts 124 and the mating object 30 when themating object 30 is coupled to the cavity 131. In one example, theconductive polymer used in the set of contacts 124 comprises aconductive elastomer; However, the set of contacts 124 can alternativelycomprise one or more contacts composed of a rigid electricallyconductive material (e.g., metal, conductive plastic, etc.) that hasbeen shaped to allow for deflection. For example, the set of contacts124 can comprise a set of metallic springs.

In some variations of the system 100, as shown in FIGS. 8 and 9 (whichillustrate exploded views of a portion of the mount interface), themounting portion can include a flexible circuit board having a pluralityof contacts on a top surface of the flexible circuit board.Additionally, the flexible circuit board can include a plurality of viaselectrically coupled to corresponding contacts on the flexible circuitboard.

The mounting portion, as illustrated in FIGS. 8 and 9, can additionallyor alternatively include a compression layer (e.g., foam pad) positionedon a bottom surface of the flexible circuit board. As described above,the compression layer can include foam (e.g., poron foam) or othermaterial capable of compressing when pressure is applied to a top andbottom surface of the compression layer. The compression layer thusfunctions to support reliable mechanical and electrical contact betweenthe contacts on the surface of the control module and correspondingcontact areas on the flexible circuit board of the mount portion.

Alternatively or additionally, the electronics substrate 120 can includeone or more through holes 126, blind holes 126, tabs 126, and/ororifices 126 which can function to enable mechanical coupling to otherportions of the system 100. For example, one or more through holes inthe electronics substrate 120 can receive registration protrusions 138(e.g., pins, bumps, dowels, etc.) connected to the mount assembly 130.In another example, an edge of the electronics substrate 120 cancomprise a series of tabs, configured to receive and mate with acorresponding series of tabs on the mount assembly 130.

In a specific configuration of the electronics substrate 120, a set oftraces along the surface of the electronics substrate 120 electricallylinks the set of vias 122, which are arrayed proximal to thecircumference of the electronics substrate 120, to the set of contacts124, which are raised from the surface of the electronics substrate 120and arrayed in a rectilinear grid circumscribed by the set of vias 122.This specific example configuration functions to route the electricalsignals from the set of vias 122, spaced out from one another accordingto the spacing of the ports of the fabric interlayer 110, to the set ofcontacts 124 which are spaced from one another according to the spacingof a set of receiving contacts on the mating object 30, which take theform of a rectilinear grid.

1.2.3 System—Mount Assembly

The mount assembly 130 is preferably coupled to the electronicssubstrate 120 such that the electronics substrate 120 is disposedbetween the mount assembly 130 and the fabric interlayer 110, anddefines a cavity 131 configured to receive the mating object 30 andelectrically interface the mating object 30 with the electronicssubstrate 120. However, the mount assembly 130 can additionally oralternatively be configured such that the electronics substrate 120 isarranged relative to the fabric interlayer no and/or the mount assembly130 in any other suitable manner. As such, the mount assembly 130functions to removably couple to and retain the mating object 30 as wellas to provide an electrical interface between the mating object 30 andthe electronics substrate 120. The mount assembly 130 is preferably madefrom a molded thermoplastic, but alternatively can be made from aflexible polymer, metal, or any other suitable material via anappropriate manufacturing process.

The mount assembly 130 preferably includes a set of openings 132 withinthe cavity 131 that are arranged to correspond to the set of contacts124 of the electronics substrate 120, such that the contacts protrudethrough the mount assembly 130 and are accessible to the mating object30 received by the cavity 131. An example instance of the set ofopenings 132 is shown in FIG. 5. In variations, the mount assembly 130can include one opening for each contact, can alternatively includeopenings that do not correspond to a contact, or can alternativelyinclude openings that permit multiple corresponding contacts to passthrough the mount assembly 130. The openings are preferably circular,but can alternatively be any suitable shape (e.g., a non-circular shapethat corresponds to a non-circular contact shape). Alternatively, therecan be one large opening in the mount assembly 130 that does notspecifically correspond to the set of contacts 124, as shown in theexample depicted in FIG. 1.

Alternatively or additionally, the mount assembly 130 can also include abevel 136′ around an edge of the cavity 131. This preferably providesrigidity to maintain the shape of 131 and ensure that the mating object30 remains in electrical communication with the system 100 undersuitable conditions. This rigidity could also be achieved by removing136 leaving only a thin wall around 131 and changing the material of 130to something stiffer (such as metal or fiber reinforced polymers), orany suitable means.

Alternatively or additionally, the mount assembly 130 can also include apartial bezel 139, to assist in retaining the mating object 30. In avariation, an example of which is shown in FIG. 5, the bevel 136′preferably defines the cavity 131, and the partial bezel 139 ispositioned at one end of the cavity 131 in order to passively retain oneend of the mating object 30 during operation. The partial bezel 139 ispreferably convex relative to the base of the cavity 131 as depicted inFIG. 5, but can alternatively be concave relative to the base of thecavity 131, parallel relative to the base of the cavity 131, or anyother suitable orientation relative to the base of the cavity 131. Thebezel could also be replaced by any geometry, feature or part orientedto suitably retain one end of the mating object 30 during operation.

Alternatively or additionally, the mount assembly 130 can include anadjustable latch 134′ which functions to secure/unsecure the matingobject 30 to/from the receiving cavity 131 of the mount assembly 130, anexample of which is shown in FIG. 5. The latch 134′ is preferably aquick-release lever (i.e., requiring a single smooth motion todisconnect the mating object 30 from the mount assembly 130), butalternatively can be an actuator of any suitable type (e.g., a keyedlatch, a rotary knob, a press-button, a slider switch, or a clip, etc.).There can alternatively be a plurality of latches 134′, wherein someand/or all of the latches must be actuated to connect/disconnect themating object 30 to/from the receiving cavity 131 of the mount assembly130. As a further alternative, there can be one or more protrusionsand/or recessed portions of the walls of the cavity 131 that canfunction cooperatively with the latch 134′ or latches 134′ to retain themating object 30 in the cavity 131.

Alternatively or additionally, the mount assembly 130 can include aflange 135 around the cavity 131 which functions to provide a substratefor mating connections between the mount assembly 130 and other portionsof the system 100. The flange 135 is preferably circumferential asdepicted in FIG. 3, but can alternatively be only partiallycircumferential, or there can be no contiguous flange 135 in favor of anumber of discontinuous flanges 135 positioned around the edge of thecavity 131 in any suitable configuration. The flange 135 can also beinternal to the edge of the cavity 131, as shown in the example depictedin FIG. 4, and be either contiguous or discontinuous as described above.

Alternatively or additionally, the mount assembly 130 can include a setof holes 136 that function to receive the set of fasteners. The holes136 are preferably blind holes 136 configured to receive a set ofscrews, as shown in FIG. 4 and FIG. 11, but can alternatively bethrough-holes, tapped holes, rivet washers, a male/female portion of asnap or clasp, or any suitable form of mating surface. The holes canalternatively be configured to receive a set of bolts, nails, pins,dowels, buttons, snaps, clasps, or any suitable form of fastener. As afurther alternative, the system 100 can include any other suitablemechanism of attaching the mount assembly 130 to other portions of thesystem Dm, such as adhesives, clamps, magnetic attraction, or the like,wherein a set of holes is not required.

Alternatively or additionally, the mount assembly 130 can include one ormore seal-supporting features 134 at the side of the mount assembly 130that is disposed against the electronics substrate 120, which functionto receive a sealing component and/or otherwise provide a waterproofseal 134 between the mount assembly 130 and the electronics substrate120. As shown in FIG. 11, the seal-supporting feature 134 is preferablyan 0-ring groove which is configured to receive an elastomeric 0-ring(i.e., the sealing component), but can alternatively be a ridgeconfigured to retain a gasket, an elastomeric region of the side of themount assembly 130 itself that is configured to provide the waterproofseal 134 upon compression of the mount assembly 130 against theelectronics substrate 120, or any other suitable feature that canfunction as described above. In variations comprising a plurality ofseal-supporting features 134, at least one seal-supporting feature 134is preferably disposed external to the set of openings 132 whichcorrespond to the set of contacts 124 of the electronics substrate 120and internal to any additional openings in the mount assembly 130, so asto prevent conductive fluid (e.g., sweat, beverages, etc.) fromshort-circuiting any of the contacts in the set of contacts 124. Invariations including the set of holes configured to receive the set offasteners, at least one seal-supporting feature 134 is preferablydisposed external to the set of holes and at least one seal-supportingfeature 134 is preferably disposed internal to the set of holes.

Additionally or alternatively, the mount assembly 130 can include a setof protrusions 138 and/or a set of depressions 138 that function toalign with and/or receive alignment surfaces 126 of the electronicssubstrate 120, as shown in FIG. 3.

1.2.4 System—Fasteners

The set of fasteners 150 is coupled to the fabric interlayer no, theelectronics substrate 120, and the mount assembly 130 by way of the setof ports 115 of the fabric interlayer no and the set of vias 122 of theelectronics substrate 120, and functions to compress the mount assembly130, the electronics substrate 120, and the fabric interlayer 110against one another in supporting a waterproof seal 134 between themount assembly 130 and the electronics substrate 120, as well as betweenthe electronics substrate 120 and the fabric interlayer no. The set offasteners 150 can also function to electrically connect the set of ports115 of the fabric interlayer no to the set of vias 122 of theelectronics substrate 120. In an example variation, the set of fasteners150 is electrically conductive and, upon mechanically joining the fabricinterlayer 110 to the electronics substrate 120, each fastener is inelectrical contact with the via and the port through which it passes,thus electrically connecting the port and the via. Preferably, the setof fasteners 150 is a set of screws. Alternatively, the set of fastenerscan include any one or more of: a rivet, a nail, a pin, a bolt, a dowel,a clip, a tie, a plug, a wire, and any suitable fastener that canprovide compression between the mount assembly 130, the electronicssubstrate 120, the fabric interlayer no, and/or any other portion of thesystem 100.

In one variation, depicted in FIGS. 7A, 7B, 7C, and 11, the set offasteners 150 is a set of metal screws wherein each screw passes througha port in the set of ports 115 in the fabric interlayer no and acorresponding via in the electronics substrate 120 before being anchoredin a blind hole in the mount assembly 130. The set of screws function tocompressively hold the fabric interlayer no, the electronics substrate120, and the mount assembly 130 together, as well as to electricallyconnect the set of ports 115 and the set of vias 122. In this variation,the set of ports 115 is preferably a set of metal grommets embedded inthe fabric interlayer 110, with an internal diameter that is slightlylarger than the major diameter of the screws. The set of vias 122likewise preferably has an internal diameter that is slightly largerthan the major diameter of the screw such that the screw. Each screw inthe set of screws is preferably screwed into a corresponding blind hole136 in the mount assembly 130, such as those depicted in FIG. 4,providing a mechanical means against which to pull the fabric interlayer110 and the electronics substrate 120 in compressing the fabricinterlayer 110, the electronics substrate 120, and the mount assembly130 together. The screw thereby creates a robust electrical connectionby pressing the grommets into the contact pads of the vias without thegrommets or the vias being damaged or interfering with insertion of thescrew.

In another variation, depicted in FIGS. 8-10, the set of fasteners 150is a set of rivets wherein each rivet passes through a hole in a flange135 of the mount assembly 130 and a corresponding hole in the fabricinterlayer 110. In this configuration, the set of rivets functions tomechanically couple the mount assembly 130 and the fabric interlayer noupon deformation of the tail of the rivet as well as provide theelectrical connection from the embroidery on 110 to the traces on 120.In an alternative of this variation, the set of ports 115 of the fabricinterlayer 110 comprises a set of rivet washers, and joining the mountassembly 130 to the fabric interlayer 110 via the set of rivets can alsofunction to electrically connect the fabric interlayer 110 to the set ofrivets, from which the electrical connections can be routed to themating object 30.

Additionally or alternatively, the set of fasteners 150 can include aplurality of different types of fasteners, which can function to,according to their type, electrically and/or mechanically couple thefabric interlayer 110 to the electronics substrate 120. For example, theset of fasteners 150 can include a subset of screws and a subset ofrivets, wherein the subset of screws functions to mechanically andelectrically couple the set of vias 122 of the electronics substrate 120to the set of ports 115 of the fabric interlayer 110 and the subset ofrivets functions only to mechanically couple the electronics substrate120 to the fabric interlayer no and/or the mount assembly 130.Alternatively, the set of fasteners 150 can include a single type offastener (e.g., screws) but with only a subset of the set of fasteners150 providing both mechanical and electrical connections between theelectronics substrate 120 and the fabric interlayer no, and theremainder of the set of fasteners 150 providing only mechanical orelectrical connections between the electronics substrate 120 and thefabric interlayer no.

1.2.5 System—Backing Nate

The system Dm can optionally include a backing plate 140, coupled to anopposing side of the fabric interlayer 110 from that closest to theelectronics substrate 120 and the mount assembly 130, and which includesa set of through holes 145 aligned with the set of ports 115. As such,the backing plate 140 functions to provide a mechanical means againstwhich to compress other portions of the system Dm, including the mountassembly 130, the electronics substrate 120, and the fabric interlayerno. The backing plate 140 can function as support for the fabricinterlayer no, so as, for example, to prevent deformations (e.g.,wrinkling, bunching) of the fabric interlayer 110 that could otherwiseinterfere with acceptable electrical signal transduction across and/orthrough the fabric interlayer no.

In variations of the system 100 including a set of fasteners 150 thatare configured to pass through portions of the system 100, the set ofthrough holes 145 of the backing plate 140 is preferably configured toreceive and correspond to the set of fasteners, such that the backingplate 140 is rigidly coupled to the electronics substrate 120 and thefabric interlayer no is compressed between the backing plate 140 and theelectronics substrate 120. Alternatively, the backing plate 140 may notbe affixed to the fabric interlayer 110 directly and/or may not compressthe fabric interlayer no.

The backing plate 140 is preferably a rigid structure with at least twosubstantially flat surfaces, of which one is preferably configured to beplaced adjacent to the fabric interlayer no such that the backing plate140 opposes the electronics substrate 120. Alternatively, the backingplate 140 can be flexible or partially flexible, or comprise alternatelyrigid and flexible regions.

Additionally or alternatively, each through hole in the set of throughholes 145 can include a conductive pad situated at a first and/or secondside of the backing plate. The conductive pad functions to provide asubstantially flat surface at which to bring conductive portions of thesystem 100 (e.g., the ports of the fabric interlayer) into electricalcommunication with the backing plate 140 and/or other suitable portionsof the system 100 (e.g., a fastener in the set of fasteners 150).

1.2.6 System—External Covers

The system 100 can optionally include one or more external covers,including an inner cover 180 which is coupled to a side of the fabricinterlayer 110 that is disposed towards the user and/or wearer of thegarment. The inner cover 180 can thus function to protect the fabricinterlayer 110 and provide an intermediary layer between the user andportions of the system 100. In variations including a backing plate 140,the inner cover 180 can further function to cover the backing plate 140.The external covers can optionally include an outer cover 170 which iscoupled to an opposing side of the fabric interlayer no from the innercover 180, and which covers at least a portion of the mount assembly 130while maintaining access to the cavity 131 of the mount assembly 130.The outer cover 170 is preferably bonded to the fabric interlayer no asdepicted, for example, in FIGS. 7A,B, and C, wherein the outer cover 170leaves the cavity 131 region exposed while coupling to the region of thefabric interlayer 110 outside the circumference of the mount assembly130. In variations including a backing plate 140, the inner cover 180 ispreferably bonded to a similar circumferential region of the fabricinterlayer no while substantially and/or entirely covering the backingplate 140, as shown, for example, in FIGS. 7A,B, and C.

1.2.7 System—Example Embodiments

In a first example embodiment of the system 100, shown in FIG. 4 andFIG. 5, the system 100 includes a fabric interlayer no, an electronicssubstrate 120, a mount assembly 130, a backing plate 140, and a set ofscrews. In this embodiment, the fabric interlayer 110 includes a set ofmetal grommets which are each coupled to a corresponding conductivethread, each conductive thread embroidered into a portion of the fabricinterlayer no as shown in FIG. 4. The electronics substrate 120 of thisexample embodiment includes a set of vias arranged such that each viacorresponds to one of the metal grommets, and the center hole of eachvia is aligned with the center hole of each metal grommet. Theelectronics substrate 120 also includes a set of protruding,frustoconical contacts arranged in a rectilinear array towards thecenter of the electronics substrate 120, such that the set of vias 122is located outside the projected area of the rectilinear array. Theelectronics substrate 120 also includes a plurality of through-holesthat do not correspond to the set of metal grommets. In this embodiment,the mount assembly 130 includes a set of openings 132 arranged such thateach opening corresponds to one of the protruding contacts and permitsthe contact to pass through the thickness of the mount assembly 130. Themount assembly 130 also includes a plurality of protruding posts thatare configured to be received by the through-holes in the electronicssubstrate 120 that do not correspond to the set of metal grommets, suchthat they can function to cooperatively mechanically couple (e.g., byway of thermally mediated plastic deformation of system components) themount assembly 130 and the electronics substrate 120. The mount assembly130 also includes a set of blind holes 136 emplaced in an internalflange 135, such that each blind hole corresponds to a via in the set ofvias 122 of the electronics substrate 120. On a side of the mountassembly 130 opposing the set of blind holes 136, the mount assembly 130includes a bevel 136′ around the circumference of the mount assembly 130such that the bevel 136′ defines the cavity 131 that is configured toreceive the mating object 30, and the bottom of the cavity 131 includesthe set of openings 132. The mount assembly 130 also includes aquick-release latch 134′ positioned at one edge of the cavity 131, aswell as a partial bezel 139 at an opposing edge of the cavity 131, suchthat both the latch 134′ and the partial bezel 139 are configured tosecurely retain the mating object 30 and permit efficient de-mating ofthe mating object 30 when desired by a user. In this embodiment, thebacking plate 140 includes a set of through holes 145 that is configuredto align with the set of grommets of the fabric interlayer no as well asthe set of vias 122 of the electronics substrate 120 and the set ofblind holes 136 of the mount assembly 130, as shown in FIG. 5. The setof screws is configured to pass through the set of through holes 145 ofthe backing plate 140 and the set of grommets of the fabric interlayerno as shown in FIG. 8, and also through the set of vias 122 of theelectronics substrate 120 and into the set of blind holes 136 of themount assembly 130. In this embodiment, the backing plate 140, thefabric interlayer no, the electronics substrate 120, and the mountassembly 130 are compressed together by the set of screws, an outercover 170 is bonded to the fabric interlayer 110 while leaving a portionof the cavity 131 uncovered (as shown by way of example in FIGS. 7A, B,and C), and an inner cover 180 is bonded to the fabric interlayer 110while covering the entirety of the backing plate 140 (as shown by way ofexample in FIGS. 7A, B, and C).

In a second example embodiment of the system 100 shown in FIGS. 8-9, thesystem 100 includes a fabric interlayer no with a set of embroideredports; a backing plate 140, including a first set of through holes 145with an arrangement corresponding to the set of embroidered ports; amount assembly 130, including a flange 135 with a second set of throughholes 136 with an arrangement corresponding to the set of rivet washers,a bevel 136′ defining the edge of the receiving cavity 131, and afairing that is configured to receive the bevel 136; a set of rivets,configured to pass through the first and second sets of through holesand the set of embroidered ports; a flexible outer cover 170, includinga removable flexible window, and configured to partially enclose thecavity 131 of the mount assembly 130 and receive the removable flexiblewindow so as to fully enclose the cavity 131 of the mount assembly 130when the flexible window is emplaced; and an inner cover 180, includinga spacer layer and an overlayer, such that the spacer layer matesdirectly to the backing plate 140 and the overlayer covers the entiretyof the portion of the system disposed on the inner side of the fabricinterlayer no (opposing the mount assembly 130. In this exampleembodiment, the rivets mechanically and electrically couple to theembroidered ports upon deforming the tails of the rivets, in order topermanently affix the system 100 to the garment via the fabricinterlayer 110 and to provide a set of access points to the electricalsignals transmitted from regions of the garment to the embroidered portsin the fabric interlayer no.

FIGS. 16-21 depict further example embodiments of portions of the system100, shown in cross-section. In particular, these FIGURES depict variousways in which portions of the system 100 can be ordered as well asvarious manners in which electrical signals can be routed throughportions of the system 100. These FIGURES are intended solely asexamples.

The system 100 can include any other suitable elements configured toenhance electrical and mechanical coupling of a mating object 30 to agarment, to easily and removably couple/decouple the mating object 30to/from the mount assembly 130, to dissipate static, to shield theconductors from noise, to prevent moisture damage to elements of thesystem 100, and/or to facilitate manufacturing of the system 100.Furthermore, as a person skilled in the art will recognize from theprevious detailed description and from the figures, modifications andchanges can be made to the system 100 without departing from the scopeof the system 100.

2. Method of Manufacture

As shown in FIG. 13, an embodiment of a method 200 for manufacturing asystem for electrically coupling a garment to a mating object comprises:providing a fabric interlayer S210; providing an electronics substratedisposed on an outer side of the fabric interlayer S220; providing amount assembly on an outer side of the electronics substrate S230;providing a backing plate on an inner side of the fabric layer S240;electrically and mechanically linking the fabric interlayer and theelectronics substrate via a set of conductive fasteners S250; coveringat least a portion of an assembly comprising the mount assembly, thebacking plate, and the fabric interlayer, with a first and a secondfluid-impermeable layer, thereby providing waterproof seals S260.

The method 200 functions to produce an electrical interface system thatis integrated with a garment intended to be worn by a user while theuser performs a physical activity. In particular, the method 200functions to produce a system that is resistant to damage by fluidassociated with an activity performed by an individual, and that retainsmechanical and electrical communication with a mating object as the userperforms the activity. As such, the method 200 can provide a systemconfigured to facilitate signal transmission associated with one or moreof: electromyography (EMG) signals, electrocardiography (ECG) signals,electroencephalograph (EEG) signals, galvanic skin response (GSR)signals, bioelectric impedance (BIA) and any other suitable biopotentialsignal of the user. The method 200 is preferably configured to producean embodiment, variation, or example of the system 100 described inSection 1 above; however, in other embodiments, sub-portions of themethod 200 can be adapted to manufacturing portions of any othersuitable system.

In providing system elements associated with Blocks S210 through S240,the method 200 preferably includes processing embodiments, variations,and examples of the system elements described in Sections 1.2.1-1.2.3,1.2.6 above. However, Blocks S210 through S240 can alternatively includeprovision of any other suitable elements.

Block S250 recites: electrically and mechanically linking the fabricinterlayer and the electronics substrate via a set of conductivefasteners. Preferably, the fabric interlayer and the electronicssubstrate are electrically and mechanically linked with a set of metalscrews as described in Section 1.2.4 above, but alternatively they canbe linked via any appropriate type of conductive fastener (e.g., rivets,pins, wire, conductive thread, or conductive adhesive).

Block S260 recites: covering at least a portion of an assemblycomprising the mount assembly, the backing plate, and the fabricinterlayer, with a first and a second fluid-impermeable layer, therebycompleting the multiple layers of waterproof seals. In variations,covering can include bonding a portion of the first and/or secondfluid-impermeable layer to a portion of the fabric interlayer, e.g.,using a thermal bonding process. Alternatively, covering can includetextile-related methods of attachment between the first and/or secondfluid-impermeable layer and the fabric interlayer (e.g., sewing,stitching, embroidering, hemming, etc.). Additionally or alternatively,at least one of the first and second fluid-impermeable layers can beomitted and there can be a single layer covering at least a portion ofthe assembly. An example depiction of the state of the assembly afterBlock S260 is shown in FIG. 15.

Blocks S210-S260 can include simultaneous implementation of Blocks.Furthermore, Blocks S210-S260 can be performed in any suitable order.For instance, in one such variation, Blocks S260 and S250 can beperformed asynchronously, in coupling both fluid-impermeable layers tothe fabric interlayer (e.g., using a thermal bonding process after thelayers of the system are aligned) prior to securing the electronicssubstrate to the fabric interlayer via the set of fasteners. Variationsof Blocks S210-S260 can, however, be implemented in any other suitablemanner.

Embodiments, variations, and examples of the method 200 can thusgenerate an electronic biosensor mating system that is more fullyintegrated with a garment, stronger, more water resistant, and requiresfewer specialized components, using a process that is lesslabor-intensive.

Variations of the system 100 and method 200 include any combination orpermutation of the described components and processes. Furthermore,various processes of the preferred method can be embodied and/orimplemented at least in part as a machine configured to receive acomputer-readable medium storing computer-readable instructions. Theinstructions are preferably executed by computer-executable componentspreferably integrated with a system and one or more portions of thecontrol module 155 and/or a processor. The computer-readable medium canbe stored on any suitable computer readable media such as RAMs, ROMs,flash memory, EEPROMs, optical devices (CD or DVD), hard drives, floppydrives, or any suitable device. The computer-executable component ispreferably a general or application specific processor, but any suitablededicated hardware device or hardware/firmware combination device, andadditionally or alternatively, entity performing manual labor, canadditionally or alternatively execute the instructions.

The FIGURES illustrate the architecture, functionality and operation ofpossible implementations of systems, methods and computer programproducts according to preferred embodiments, example configurations, andvariations thereof. In this regard, each block in the flowchart or blockdiagrams can represent a module, segment, step, or portion of code,which comprises one or more executable instructions for implementing thespecified logical function(s). It should also be noted that, in somealternative implementations, the functions noted in the block can occurout of the order noted in the FIGURES. For example, two blocks shown insuccession can, in fact, be executed substantially concurrently, or theblocks can sometimes be executed in the reverse order, depending uponthe functionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts, or combinations of special purpose hardware andcomputer instructions.

As a person skilled in the art will recognize from the previous detaileddescription and from the figures and claims, modifications and changescan be made to the preferred embodiments of the invention withoutdeparting from the scope of this invention defined in the followingclaims.

We claim:
 1. A system comprising: a fabric layer of a garment includinga set of electrical contacts in communication with a set of biometricsensors of the garment; an electronics substrate adjacent to the fabriclayer, comprising a set of vias; a mount assembly, defining a cavityconfigured to receive and electrically interface an electronic device tothe electronics substrate; and a set of fasteners electrically andmechanically coupling the set of electrical contacts of the fabriclayer, the set of vias of the electronics substrate, and the mountassembly in supporting a waterproof seal, wherein at least oneelectrical contact in the set of electrical contacts is electricallyconductive and secured to the fabric layer such that at least a portionof an electrical contact of the fabric layer is adjacent to theelectronics substrate and brought into electrical communication with avia in the set of vias of the electronics substrate.
 2. The system ofclaim 1, wherein the set of electrical contacts is a set of electricallyconductive ports secured to the fabric layer.
 3. The system of claim 2,wherein the set of fasteners comprises a set of electrically conductivefasteners, and a set of embedded ports is a set of electricallyconductive grommets, wherein each electrically conductive grommetcomprises a through hole configured to receive an electricallyconductive fastener in the set of electrically conductive fasteners. 4.The system of claim 1, wherein the mount assembly further comprises alatch configured to removably couple the electronic device to the mountassembly during operation.
 5. The system of claim 1, wherein the mountassembly further comprises a snap connector configured to removablycouple the electronic device to the mount assembly during operation. 6.The system of claim 1, further comprising a groove in the mount assemblyand an elastomeric ring seated in the groove, which, during operation,provides a waterproof seal between the mount assembly and the electronicdevice.
 7. The system of claim 1, further comprising a set ofelastomeric contacts protruding from the electronics substrate and intoa set of openings of the mount assembly, the set of elastomeric contactselectrically connected to the set of vias and configured to electricallyinterface the electronic device to the electronics substrate by way ofthe mount assembly.
 8. The system of claim 7, wherein each elastomericcontact in the set of elastomeric contacts is elastically deformable andconfigured to dynamically resist a force provided by the electronicdevice towards the electronics substrate during operation.
 9. The systemof claim 1, wherein each electrical contact in the set of electricalcontacts comprises a first portion of a metal snap coupler, and whereineach via in the set of vias of the electronics substrate comprises asecond portion of the metal snap coupler.
 10. The system of claim 1,further comprising a backing structure, adjacent to a first side of thefabric layer, comprising a set of through holes aligned with the set ofelectrical contacts, wherein the backing structure is coupled to thefabric layer by the set of fasteners.
 11. The system of claim 1, whereinthe mount assembly comprises a set of blind holes aligned with the setof vias and the set of electrical contacts.
 12. A system forelectrically coupling a garment to a mating object, the systemcomprising: a fabric layer of the garment including a first set ofelectrical contacts coupled to a set of biometric sensors integratedwith the garment; an electronics substrate adjacent to the fabric layerand comprising a second set of electrical contacts; a mount assemblycomprising a cavity configured to receive and electrically interface anelectronic device to the electronics substrate; and a set of fasteners,configured to couple the mount assembly and the electronics substrate tothe fabric layer, each fastener in the set of fasteners concentricallyaligned with and contacting a corresponding electrical contact in atleast one of the first set of electrical contacts and the second set ofelectrical contacts in providing a mechanical and electrical connectionbetween the first and the second sets of electrical contacts.
 13. Thesystem of claim 12, wherein the mount assembly further comprises a snapconnector configured to couple the electronic device to the mountassembly during operation.
 14. The system of claim 12, wherein the firstset of electrical contacts comprises a set of embedded ports coupled tothe fabric layer, wherein at least one embedded port in the set ofembedded ports is electrically conductive and secured to the fabriclayer.
 15. The system of claim 14, wherein the second set of electricalcontacts comprises a set of vias through the electronics substrate, andwherein the set of fasteners comprises a set of electrically conductivefasteners coupling the set of embedded ports to the set of vias.
 16. Thesystem of claim 12, wherein the garment is configured to couple to alower body region of a user, and wherein the set of biometric sensorscomprise electromyography sensors coupled to the garment.
 17. The systemof claim 16, wherein the set of fasteners comprises a set ofelectrically conductive plugs.
 18. The system of claim 12, furthercomprising a first liquid-impermeable layer covering at least a portionof the mount assembly and affixed to the fabric layer at a first side.19. The system of claim 12, further comprising a set of elastomericcontacts passing from a set of vias, and through a set of openings ofthe mount assembly, the set of elastomeric contacts configured tointerface with the electronic device.
 20. The system of claim 19,wherein each elastomeric contact in the set of elastomeric contacts iselastically deformable and configured to deform under a force providedby the electronic device towards the electronics substrate duringoperation.